The influence of packaging materials on RF performance. - Arun Chandrasekhar; Steven Brebels; Serguei Stoukatch; Eric Beyne; Walter De Raedt; Bart Nauwelaers (Microelectron. Reliab., 2003)

Direct gold and copper wires bonding on copper. - Hong Meng Ho; Wai Lam; Serguei Stoukatch; Petar Ratchev; Charles J. Vath; Eric Beyne (Microelectron. Reliab., 2003)

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads. - Petar Ratchev; Serguei Stoukatch; Bart Swinnen (Microelectron. Reliab., 2006)

Smart-shoe self-powered by walking. - Gérald Colson; Philippe Laurent; Pierre Bellier; Serguei Stoukatch; François Dupont; Michael Kraft (BSN, 2017)

Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. - Serguei Stoukatch; Nicolas André; Thibault P. Delhaye; François Dupont; Jean-Michel Redouté; Denis Flandre (IEEE SENSORS, 2020)

Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors. - Serguei Stoukatch; Jean-François Fagnard; François Dupont; Philippe Laurent; Marc Debliquy; Jean-Michel Redouté (IEEE Access, 2022)

Design Aspects for Portable LED-Based Colorimetric Characterisation Systems Targeting Liquid Analytes. - François Dupont; Serguei Stoukatch; Philippe Laurent; Kasper Eersels; Bart van Grinsven; Jean-Michel Redouté (Sensors, 2024)