Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies. - Chuan Xu; Lijun Jiang; Seshadri K. Kolluri; Barry J. Rubin; Alina Deutsch; Howard H. Smith; Kaustav Banerjee (ICCAD, 2009)

Analytical Thermal Model for Self-Heating in Advanced FinFET Devices With Implications for Design and Reliability. - Chuan Xu; Seshadri K. Kolluri; Kazuhiko Endo; Kaustav Banerjee (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013)

Correction to "Analytical Thermal Model for Self-Heating in Advanced FinFET Devices With Implications for Design and Reliability". - Chuan Xu; Seshadri K. Kolluri; Kazuhiko Endo; Kaustav Banerjee (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020)