Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. - Jong-Woong Kim; Dae-Gon Kim; Seung-Boo Jung (Microelectron. Reliab., 2006)

High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. - Jeong-Won Yoon; Seung-Boo Jung (Microelectron. Reliab., 2006)

Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package - Ja-Myeong Koo; Seung-Boo Jung (CoRR, 2007)

Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications - Jeong-Won Yoon; Hyun-Suk Chun; Ja-Myeong Koo; Seung-Boo Jung (CoRR, 2007)

Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging. - Ja-Myeong Koo; Seung-Boo Jung (Microelectron. Reliab., 2007)

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint. - Jong-Woong Kim; Jin-Kyu Jang; Sang-Ok Ha; Sang-Su Ha; Dae-Gon Kim; Seung-Boo Jung (Microelectron. Reliab., 2008)

Effect of surface finish material on printed circuit board for electrochemical migration. - Bo-In Noh; Jong-Bum Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)

Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. - Jeong-Won Yoon; Hyun-Suk Chun; Bo-In Noh; Ja-Myeong Koo; Jong-Woong Kim; Hoo-Jeong Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)

Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. - Jeong-Won Yoon; Bo-In Noh; Young-Ho Lee; Hyo-Soo Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test. - Jeong-Won Yoon; Min-Kwan Ko; Bo-In Noh; Seung-Boo Jung (Microelectron. Reliab., 2013)

Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions. - Jeong-Won Yoon; Bo-In Noh; Seung-Boo Jung (Microelectron. Reliab., 2014)

Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications. - Dae Up Kim; Kwang-Seok Kim; Seung-Boo Jung (Microelectron. Reliab., 2016)