A case study of 3D simulation for developing automatic assembly line in the phone-camera industry. - Dug Hee Moon; Seung Geun Baek; Jun Seok Lee; Bing Lin Zhang; Yang Woo Shin; Young Gyoo Kim (SpringSim (3), 2007)

A simulation study of the transmission case line in an automotive factory. - Dug Hee Moon; Te Xu; Seung Geun Baek; Jun Seok Lee; Woo Young Shin (SpringSim (3), 2007)

A simulation study integrated with analytic hierarchy process (AHP) in an automotive manufacturing system. - Te Xu; Dug Hee Moon; Seung Geun Baek (Simul., 2012)

A 1.2V 64Gb 341GB/S HBM2 stacked DRAM with spiral point-to-point TSV structure and improved bank group data control. - Jin-Hee Cho; Jihwan Kim; Wooyoung Lee; Dong-Uk Lee; Tae-Kyun Kim 002; Heat Bit Park; Chunseok Jeong; Myeong-Jae Park; Seung Geun Baek; Seokwoo Choi; Byung Kuk Yoon; Young Jae Choi; et al. (ISSCC, 2018)

A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization. - Myeong-Jae Park; Ho Sung Cho; Tae-Sik Yun; Sangjin Byeon; Young Jun Koo; Sang-Sic Yoon; Dong-Uk Lee; Seokwoo Choi; Ji Hwan Park; Jinhyung Lee; Kyungjun Cho; Junil Moon; et al. (ISSCC, 2022)