A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for 3-Dimensional System Packages. - Seung-Mo Noh; Seungkyu Kim; Seo-Yoon Lee; Kee-Won Kwon (ICEIC, 2024)

An Invariant Interconnect Delay Monitoring Circuit for 3D System Scaling. - Seung-Mo Noh; Kee-Won Kwon (ISOCC, 2024)