Fabrication and packaging of microbump interconnections for 3D TSV. - Seung Wook Yoon; Jae Hoon Ku; Nathapong Suthiwongsunthorn; Pandi Chelvam Marimuthu; Flynn Carson (3DIC, 2009)

3D TSV processes and its assembly/packaging technology. - Seung Wook Yoon; Dae Wook Yang; Jae Hoon Koo; Meenakshi Padmanathan; Flynn Carson (3DIC, 2009)