Systematical study of 14nm FinFET reliability: From device level stress to product HTOL. - Changze Liu; Hyun-Chul Sagong; Hyejin Kim; Seungjin Choo; Hyunwoo Lee; Yoohwan Kim; Hyunjin Kim; Bisung Jo; Minjung Jin; Jinjoo Kim; Sangsu Ha; Sangwoo Pae; et al. (IRPS, 2015)

Effects of Far-BEOL anneal on the WLR and product reliability characterization of FinFET process technology. - Hyun-Chul Sagong; Hyunjin Kim; Seungjin Choo; Sungyoung Yoon; Hyewon Shim; Sangsu Ha; Tae-Young Jeong; Minhyeok Choe; Junekyun Park; Sangchul Shin; Sangwoo Pae (IRPS, 2018)

Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology. - Seongkyung Kim; Ukjin Jung; Seungjin Choo; Kihyun Choi; Tae-Jin Chung; Shin-Young Chung; Euncheol Lee; Juhun Park; Deokhan Bae; Myungyoon Um (IRPS, 2022)

Reverse Body Bias Dependence of HCI Reliability in Advanced FinFET. - Md Iqbal Mahmud; Rakesh Ranjan; Ki-Don Lee; Pavitra Ramadevi Perepa; Caleb Dongkyun Kwon; Seungjin Choo; Kihyun Choi (IRPS, 2022)

Machine Learning Based V-ramp VBD Predictive Model Using OCD-measured Fab Parameters for Early Detection of MOL Reliability Risk. - SungMan Rhee; Hyunjin Kim; Sangku Park; Taiki Uemura; Yuchul Hwang; Seungjin Choo; Jinju Kim; Hwasung Rhee; Shin-Young Chung (IRPS, 2023)