An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration. - Tsung-Yen Tsai; Chien-Hung Lin; Chia-Lin Lee; Shan-Chun Yang; Kuan-Neng Chen (3DIC, 2015)

The influence of device morphology on wafer-level bonding with polymer-coated layer. - Hao-Wen Liang; Hsiu-Chi Chen; Chien-Hung Lin; Chia-Lin Lee; Shan-Chun Yang; Kuan-Neng Chen (3DIC, 2016)