Dual-sided process with graded interfaces for adhering underfill and globtop materials to microelectrode arrays. - Sharif Khan; Juan S. Ordonez; Thomas Stieglitz (NER, 2017)

PDMS Gasket Underfill for Long-Term Insulation of High-Density Interconnections in Active Implantable Medical Devices. - Sharif Khan; Daniel Scholz 002; Juan S. Ordonez; Thomas Stieglitz (EMBC, 2018)