Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology. - Rahul Mathur; Chien-Ju Chao; Rossana Liu; Nikhil Tadepalli; Pranavi Chandupatla; Shawn Hung; Xiaoqing Xu; Saurabh Sinha; Jaydeep Kulkarni (CoRR, 2020)

3D-Split SRAM: Enabling Generational Gains in Advanced CMOS. - Rahul Mathur; Mudit Bhargava; Heath Perry; Alberto Cestero; Frank Frederick; Shawn Hung; Chien-Ju Chao; Daniel Smith; Daniel Fisher; Norman Robson; Xiaoqing Xu; Pranavi Chandupatla; et al. (CICC, 2021)

Applying IEEE Std 1838 to the 3DIC Design Trishul - A Case Study. - Teresa L. McLaurin; Frank Frederick; Heath Perry; Shawn Hung; Saurabh Sinha (ETS, 2021)

System technology co-optimization and design challenges for 3D IC. - Supreet Jeloka; Brian Cline; Shidhartha Das; Benoit Labbe; Alejandro Rico; Rainer Herberholz; Javier A. DeLaCruz; Rahul Mathur; Shawn Hung (CICC, 2022)