In-situ X-ray μLaue diffraction study of copper through-silicon vias. - Dario Ferreira Sanchez; Shay Reboh; Monica Larissa Djomeni Weleguela; Jean-Sébastien Micha; Odile Robach; Thierry Mourier; Patrice Gergaud; Pierre Bleuet (Microelectron. Reliab., 2016)

Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections. - A. Vandooren; N. Parihar; Jacopo Franco; Roger Loo; Hiroaki Arimura; R. Rodriguez; F. Sebaai; S. Iacovo; Kevin Vandersmissen; W. Li; G. Mannaert; D. Radisic; et al. (VLSI Technology and Circuits, 2022)