Temperature prediction of rolling tires by computer simulation. - Yeong-Jyh Lin; Sheng-Jye Hwang (Math. Comput. Simul., 2004)

Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method. - Shiang-Yu Teng; Sheng-Jye Hwang (Microelectron. Reliab., 2007)

Finite Element Analysis of Film Stack Architecture for Complementary Metal-Oxide-Semiconductor Image Sensors. - Kuo-Tsai Wu; Sheng-Jye Hwang; Huei-Huang Lee (Sensors, 2017)

Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis. - Kuo-Tsai Wu; Sheng-Jye Hwang; Huei-Huang Lee (Sensors, 2017)

Accurate numerical simulations of capillary underfill process for flip-chip packages. - Yu-Chi Cheng; Yu-Hsien Chen; Hao-Hsi Hung; Sheng-Jye Hwang; Dao-Long Chen; Hui-Jing Chang; Bing-Yuan Huang; Hung-Hsien Huang; Chen-Chao Wang; Chih-Pin Hung (Eng. Comput., 2025)