Research on the Online Evaluation Approach for the Digital Evolvable Hardware. - Rui Yao; Youren Wang; Sheng-lin Yu; Guijun Gao (ICES, 2007)

Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages. - Liang Zhang; Songbai Xue; Li-li Gao; Zhong Sheng; Sheng-lin Yu; Yan Chen; Wei Dai; Feng Ji; Zeng Guang (Microelectron. Reliab., 2010)