P/G TSV planning for IR-drop reduction in 3D-ICs. - Shengcheng Wang; Farshad Firouzi; Fabian Oboril; Mehdi Baradaran Tahoori (DATE, 2014)

Stress-aware P/G TSV planning in 3D-ICs. - Shengcheng Wang; Farshad Firouzi; Fabian Oboril; Mehdi Baradaran Tahoori (ASP-DAC, 2015)

Defect Clustering-Aware Spare-TSV Allocation for 3D ICs. - Shengcheng Wang; Mehdi Baradaran Tahoori; Krishnendu Chakrabarty (ICCAD, 2015)

Deadspace-aware Power/Ground TSV planning in 3D floorplanning. - Shengcheng Wang; Farshad Firouzi; Fabian Oboril; Mehdi Baradaran Tahoori (ICICDT, 2015)

Multicast Test Architecture and Test Scheduling for Interposer-Based 2.5D ICs. - Shengcheng Wang; Ran Wang 002; Krishnendu Chakrabarty; Mehdi Baradaran Tahoori (ATS, 2016)

Thermal-aware TSV repair for electromigration in 3D ICs. - Shengcheng Wang; Mehdi Baradaran Tahoori; Krishnendu Chakrabarty (DATE, 2016)

Recovery-aware proactive TSV repair for electromigration in 3D ICs. - Shengcheng Wang; Hengyang Zhao; Sheldon X.-D. Tan; Mehdi Baradaran Tahoori (DATE, 2017)

Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. - Shengcheng Wang; Zeyu Sun 001; Yuan Cheng; Sheldon X.-D. Tan; Mehdi Baradaran Tahoori (ICCAD, 2017)

Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs. - Shengcheng Wang; Mehdi Baradaran Tahoori (IEEE Trans. Very Large Scale Integr. Syst., 2017)

Multicast Testing of Interposer-Based 2.5D ICs: Test-Architecture Design and Test Scheduling. - Shengcheng Wang; Ran Wang 002; Krishnendu Chakrabarty; Mehdi Baradaran Tahoori (ACM Trans. Design Autom. Electr. Syst., 2018)

Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. - Shengcheng Wang; Taeyoung Kim 001; Zeyu Sun 001; Sheldon X.-D. Tan; Mehdi Baradaran Tahoori (IEEE Trans. Very Large Scale Integr. Syst., 2018)

Reliable Design of Three-Dimensional Integrated Circuits - Shengcheng Wang (2018)

Defect Clustering-Aware Spare-TSV Allocation in 3-D ICs for Yield Enhancement. - Shengcheng Wang; Krishnendu Chakrabarty; Mehdi Baradaran Tahoori (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019)

COMB-MCM: Computing-on-Memory-Boundary NN Processor with Bipolar Bitwise Sparsity Optimization for Scalable Multi-Chiplet-Module Edge Machine Learning. - Haozhe Zhu; Bo Jiao; Jinshan Zhang 006; Xinru Jia; Yunzhengmao Wang; Tianchan Guan; Shengcheng Wang; Dimin Niu; Hongzhong Zheng; Chixiao Chen; Mingyu Wang 001; Lihua Zhang; et al. (ISSCC, 2022)