An analytical approach for solving type-1 and type-2 fully fuzzy linear systems of equations. - Sheriff Sadiqbatcha; Saeed Jafarzadeh (FUZZ-IEEE, 2016)

Accelerating electromigration aging for fast failure detection for nanometer ICs. - Zeyu Sun 001; Sheriff Sadiqbatcha; Hengyang Zhao; Sheldon X.-D. Tan (ASP-DAC, 2018)

Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. - Sheriff Sadiqbatcha; Chase Cook; Zeyu Sun 001; Sheldon X.-D. Tan (SMACD, 2018)

Particle Swarm Optimization for Solving a Class of Type-1 and Type-2 Fuzzy Nonlinear Equations. - Sheriff Sadiqbatcha; Saeed Jafarzadeh; Yiannis Ampatzidis (J. Artif. Intell. Soft Comput. Res., 2018)

Hot Spot Identification and System Parameterized Thermal Modeling for Multi-Core Processors Through Infrared Thermal Imaging. - Sheriff Sadiqbatcha; Hengyang Zhao; Hussam Amrouch; Jörg Henkel; Sheldon X.-D. Tan (DATE, 2019)

Reliability based hardware Trojan design using physics-based electromigration models. - Chase Cook; Sheriff Sadiqbatcha; Zeyu Sun 001; Sheldon X.-D. Tan (Integr., 2019)

Saturation-Volume Estimation for Multisegment Copper Interconnect Wires. - Zeyu Sun 001; Sheriff Sadiqbatcha; Hengyang Zhao; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2019)

EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks. - Han Zhou 002; Zeyu Sun 001; Sheriff Sadiqbatcha; Naehyuck Chang; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2019)

Machine Learning Based Online Full-Chip Heatmap Estimation. - Sheriff Sadiqbatcha; Yue Zhao; Jinwei Zhang; Hussam Amrouch; Jörg Henkel; Sheldon X.-D. Tan (ASP-DAC, 2020)

Accurate Power Density Map Estimation for Commercial Multi-Core Microprocessors. - Jinwei Zhang; Sheriff Sadiqbatcha; Wentian Jin; Sheldon X.-D. Tan (DATE, 2020)

Full-Chip Thermal Map Estimation for Commercial Multi-Core CPUs with Generative Adversarial Learning. - Wentian Jin; Sheriff Sadiqbatcha; Jinwei Zhang; Sheldon X.-D. Tan (ICCAD, 2020)

EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects. - Wentian Jin; Sheriff Sadiqbatcha; Zeyu Sun 001; Han Zhou 002; Sheldon X.-D. Tan (ICCD, 2020)

HAT-DRL: Hotspot-Aware Task Mapping for Lifetime Improvement of Multicore System using Deep Reinforcement Learning. - Jinwei Zhang; Sheriff Sadiqbatcha; Yuanqi Gao; Michael O'Dea; Nanpeng Yu; Sheldon X.-D. Tan (MLCAD, 2020)

EM-GAN: Fast Stress Analysis for Multi-Segment Interconnect Using Generative Adversarial Networks. - Wentian Jin; Sheriff Sadiqbatcha; Jinwei Zhang; Sheldon X.-D. Tan (CoRR, 2020)

Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. - Sheldon X.-D. Tan; Zeyu Sun 001; Sheriff Sadiqbatcha (IPSJ Trans. Syst. LSI Des. Methodol., 2020)

Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. - Sheriff Sadiqbatcha; Zeyu Sun 001; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020)

EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks. - Wentian Jin; Liang Chen 025; Sheriff Sadiqbatcha; Shaoyi Peng; Sheldon X.-D. Tan (DAC, 2021)

Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging. - Sheriff Sadiqbatcha; Jinwei Zhang; Hengyang Zhao; Hussam Amrouch; Jörg Henkel; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021)

Towards Addressing Thermal and Reliability Challenges in Nanometer Integrated Circuits - Sheriff Sadiqbatcha (2021)

Real-Time Full-Chip Thermal Tracking: A Post-Silicon, Machine Learning Perspective. - Sheriff Sadiqbatcha; Jinwei Zhang; Hussam Amrouch; Sheldon X.-D. Tan (IEEE Trans. Computers, 2022)

Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach. - Liang Chen 025; Sheriff Sadiqbatcha; Hussam Amrouch; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022)

Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling. - Jinwei Zhang; Sheriff Sadiqbatcha; Michael O'Dea; Hussam Amrouch; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022)

Hot-spot aware thermoelectric array based cooling for multicore processors. - Jinwei Zhang; Sheriff Sadiqbatcha; Liang Chen 025; Cuong Thi; Sachin Sachdeva; Hussam Amrouch; Sheldon X.-D. Tan (Integr., 2023)

Hot-Trim: Thermal and Reliability Management for Commercial Multicore Processors Considering Workload Dependent Hot Spots. - Jinwei Zhang; Sheriff Sadiqbatcha; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023)