Micro-Structural Study of Fretting Contact Caused by the Difference of the Tin Plating Thickness. - Tetsuya Ito; Shigeru Sawada; Yasuhiro Hattori; Yasushi Saitoh; Terutaka Tamai; Kazuo Iida (IEICE Trans. Electron., 2008)

Influence of Fretting Wear on Lifetime of Tin Plated Connectors. - Hirosaka Ikeda; Tetsuya Ito; Shigeru Sawada; Yasuhiro Hattori; Yasushi Saitoh; Terutaka Tamai; Kazuo Iida (IEICE Trans. Electron., 2009)

Contact Area Analysis by FEM with Plating Layer for Electrical Contact. - Kaori Shimizu; Shigeki Shimada; Shigeru Sawada; Yasuhiro Hattori (IEICE Trans. Electron., 2009)

Constriction Resistance Behavior of a Tin or Silver Plated Layer for an Electrical Contact. - Shigeru Sawada; Kaori Shimizu; Yasuhiro Hattori; Terutaka Tamai (IEICE Trans. Electron., 2010)

Numerical Analyses for Contact Resistance due to Constriction Effect of Current Flowing through Multi-Spot Construction. - Shigeru Sawada; Terutaka Tamai; Yasuhiro Hattori; Kazuo Iida (IEICE Trans. Electron., 2010)

Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors. - Terutaka Tamai; Shigeru Sawada; Yasuhiro Hattori (IEICE Trans. Electron., 2010)

Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading. - Terutaka Tamai; Shigeru Sawada; Yasuhiro Hattori (IEICE Trans. Electron., 2012)

Effect of Hardness on Wear and Abrasion Resistance of Silver Plating on Copper Alloy. - Shigeru Sawada; Song-Zhu Kure-Chu; Rie Nakagawa; Toru Ogasawara; Hitoshi Yashiro; Yasushi Saitoh (IEICE Trans. Electron., 2017)