Enhanced anisotropic conductive film (ACF) void-free bonding for Chip-On-Glass (COG) packages by means of low temperature plasmas. - Yung-Sen Lin; Jian-Zhi Xu; Shih-Wei Tien; Shih-Chan Hung; Wei-Li Yuan; Tsair-Wang Chung; Char-Ming Huang (Microelectron. Reliab., 2012)

Understanding the roles of cultural differences and socio-economic status in social media continuance intention. - Meng-Hsiang Hsu; Shih-Wei Tien; Hsien-Cheng Lin; Chun-Ming Chang (Inf. Technol. People, 2015)