Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density. - Takuya Kadoguchi; Keisuke Gotou; Kimihiro Yamanaka; Shijo Nagao; Katsuaki Suganuma (Microelectron. Reliab., 2015)

Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure. - Dongjin Kim 002; Chuantong Chen; Aiji Suetake; Chanyang Choe; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma (Microelectron. Reliab., 2018)