A 2.2um three-wafer stacked back side illuminated voltage domain global shutter CMOS image sensor. - Shimpei Fukuoka; Masayuki Uchiyama; Geunsook Park; Alan Chih-Wei Hsiung; Mourad Daoudi; Zhiqiang Lin; Vincent C. Venezia; Lindsay A. Grant (Imaging Sensors and Systems, 2023)

A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1 MPixel EVS with 4.6GEvent/s Readout, In-Pixel TDC and On-Chip ISP and ESP Function. - Menghan Guo; Shoushun Chen; Zhe Gao; Wenlei Yang; Peter Bartkovjak; Qing Qin; Xiaoqin Hu; Dahei Zhou; Masayuki Uchiyama; Shimpei Fukuoka; Chengcheng Xu; Hiroaki Ebihara; et al. (ISSCC, 2023)

A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and On-Chip ISP and ESP Function. - Menghan Guo; Shoushun Chen; Zhe Gao; Wenlei Yang; Peter Bartkovjak; Qing Qin; Xiaoqin Hu; Dahai Zhou; Qiping Huang; Masayuki Uchiyama; Yoshiharu Kudo; Shimpei Fukuoka; et al. (IEEE J. Solid State Circuits, 2023)