Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. - Chan-Yen Chou; Tuan-Yu Hung; Shin-Yueh Yang; Ming-Chih Yew; Wen-Kun Yang; Kuo-Ning Chiang (Microelectron. Reliab., 2008)

Fabrication process simulation and reliability improvement of high-brightness LEDs. - Tsung-Lin Chou; Chien-Fu Huang; Cheng-Nan Han; Shin-Yueh Yang; Kuo-Ning Chiang (Microelectron. Reliab., 2009)

Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III-V material. - Tsung-Lin Chou; Shin-Yueh Yang; Chung-Jung Wu; Cheng-Nan Han; Kuo-Ning Chiang (Microelectron. Reliab., 2011)

Light degradation test and design of thermal performance for high-power light-emitting diodes. - Yen-Fu Su; Shin-Yueh Yang; Tuan-Yu Hung; Chang-Chun Lee; Kuo-Ning Chiang (Microelectron. Reliab., 2012)