Isolation Techniques Against Substrate Noise Coupling Utilizing Through Silicon Via (TSV) Process for RF/Mixed-Signal SoCs. - Shinichiro Uemura; Yukio Hiraoka; Takayuki Kai; Shiro Dosho (IEEE J. Solid State Circuits, 2012)

Design and Evaluation of a Diffusion Tracing Function for Classified Information Among Multiple Computers. - Nobuto Otsubo; Shinichiro Uemura; Toshihiro Yamauchi; Hideo Taniguchi (MUE, 2013)