Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape. - Tadatomo Yamada; Ken Takano; Toshiaki Menjo; Shinya Takyu (3DIC, 2019)

A Novel Direct Transfer Bonding Process with Particle Less Tapes for Die to Wafer Integration. - Tomoka Kirihata; Masanori Yamagishi; Ichiro Sano; Haruka Morita; Yusuke Fumita; Shinya Takyu (3DIC, 2024)