PDN impedance and SSO noise simulation of 3D system-in-package with a widebus structure. - Yoshiaki Oizono; Yoshitaka Nabeshima; Takafumi Okumura; Toshio Sudo; Atsushi Sakai; Shiro Uchiyama; Hiroaki Ikeda (3DIC, 2011)

A 100GB/s wide I/O with 4096b TSVs through an active silicon interposer with in-place waveform capturing. - Satoshi Takaya; Makoto Nagata; Atsushi Sakai; Takashi Kariya; Shiro Uchiyama; Harufumi Kobayashi; Hiroaki Ikeda (ISSCC, 2013)