Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. - Dau Fatt Lim; Shiv Govind Singh; Xiao Fang Ang; Jun Wei; Chee Mang Ng; Chuan Seng Tan (3DIC, 2009)

Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack. - Shiv Govind Singh; Chuan Seng Tan (3DIC, 2009)

A reconfigurable aperture coupled microstrip patch antenna with beam steering capability on silicon. - S. Pradeep Reddy; Ashudeb Dutta; Shiv Govind Singh (APCCAS, 2012)

Noise-cancelled subthreshold UWB LNA for Wireless Sensor Network application. - A. R. Aravinth Kumar; Ashudeb Dutta; Shiv Govind Singh (ICUWB, 2012)

A 1.5-7.5GHz low power low noise amplifier (LNA) design using subthreshold technique for Wireless Sensor Network (WSN) application. - A. R. Aravinth Kumar; Ashudeb Dutta; Shiv Govind Singh (ISCAS, 2012)

A Tuneable CMOS Pulse Generator for Detecting the Cracks in Concrete Walls. - Trivikrama Rao; Ashudeb Dutta; Shiv Govind Singh; Arijit De; Bhibu Dutta Sahoo (ISVLSI, 2012)

Phase noise reduction of an oscillator using harmonic mixing technique. - R. Sai Chandra Teja; Sachin Kalia; Ashudeb Dutta; Shiv Govind Singh (MWSCAS, 2012)

Efficient adaptive switch design for charge pumps in micro-scale energy harvesting. - K. T. Hafeez; Ashudeb Dutta; Shiv Govind Singh (VLSI-SoC, 2012)

A low pull-in SU-8 based Capacitive Micromachined Ultrasonic Transducer for medical imaging applications. - Jose Joseph; Shiv Govind Singh; Siva Rama Krishna Vanjari (EMBC, 2014)

Efficient Dual Band RF Energy Harvesting Front End for Ultra Low Power Sensitive Passive Wearable Devices. - Pramod Kaddi; Nagaveni Vamsi; Anil Appala; Ashudeb Dutta; Shiv Govind Singh; Nagarjuna Nallam (ISED, 2014)

Active Cooling Technique for Efficient Heat Mitigation in 3D-ICs. - Pramod Kaddi; Basireddy Karunakar Reddy; Shiv Govind Singh (VLSID, 2014)

Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. - Asisa Kumar Panigrahi; Satish Bonam; Tamal Ghosh; Siva Rama Krishna Vanjari; Shiv Govind Singh (3DIC, 2015)

TSV noise coupling in 3D IC using guard ring. - R. Ranga Reddy; Sugandh Tanna; Shiv Govind Singh; Om Krishna Singh (3DIC, 2015)

DP-fill: a dynamic programming approach to X-filling for minimizing peak test power in scan tests. - Satya Trinadh; Ch. Sobhan Babu; Shiv Govind Singh; Seetal Potluri; V. Kamakoti 001 (DATE, 2015)

A reconfigurable medically cohesive biomedical front-end with ΣΔ ADC in 0.18µm CMOS. - Pankaj Kumar Jha; Pravanjan Patra; Jairaj Naik; Amit Acharyya; Pachamuthu Rajalakshmi; Shiv Govind Singh; Ashudeb Dutta (EMBC, 2015)

Fabrication of SU-8 based Capacitive Micromachined Ultrasonic Transducer for low frequency therapeutic applications. - Jose Joseph; Shiv Govind Singh; Siva Rama Krishna Vanjari (EMBC, 2015)

Low power reconfigurable multi-mode LNA utilizing subthreshold bias and low-Q inductors. - A. R. Aravinth Kumar; Shiv Govind Singh; Ashudeb Dutta (ISCAS, 2015)

A 2μW biomedical frontend with ΣΔ ADC for self-powered U-healthcare devices in 0.18μm CMOS technology. - Pankaj Kumar Jha; Pravanjan Patra; Jairaj Naik; Ashudeb Dutta; Amit Acharyya; Pachamuthu Rajalakshmi; Shiv Govind Singh (NEWCAS, 2015)

A low/high band highly linearized reconfigurable down conversion mixer in 65nm CMOS process. - Nisha Gupta; Ashudeb Dutta; Shiv Govind Singh (NORCAS, 2015)

Ultra low power on-chip hybrid start-up for wireless sensor networks. - Nagaveni Vamsi; Akash Gupta; Ashudeb Dutta; Shiv Govind Singh (NORCAS, 2015)

A 1.2V wide-band reconfigurable mixer for wireless application in 65nm CMOS technology. - Nisha Gupta; A. R. Aravinth Kumar; Ashudeb Dutta; Shiv Govind Singh (SoCC, 2015)

A -30 dBm sensitive ultra low power RF energy harvesting front end with an efficiency of 70.1% at -22 dBm. - Nagaveni Vamsi; Pramod Kaddi; Ashudeb Dutta; Shiv Govind Singh (SoCC, 2015)

Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. - Kumail Khurram; Asisa Kumar Panigrahi; Satish Bonam; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC. - C. Hemanth Kumar; Asisa Kumar Panigrahi; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration. - Asisa Kumar Panigrahi; Satish Bonam; Tamal Ghosh; Siva Rama Krishna Vanjari; Shiv Govind Singh (3DIC, 2016)

Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. - Suraj Patil; Asisa Kumar Panigrahi; Satish Bonam; C. Hemanth Kumar; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC. - Suraj Singh; Asisa Kumar Panigrahi; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

A compact, resource sharing on-chip soft-start technique for automotive DC-DC converters. - K. T. Hafeez; Ashudeb Dutta; Shiv Govind Singh; Krishna Kanth Gowri Avalur (APCCAS, 2016)

A -34dBm sensitivity battery-less wake-up receiver with digital decoder. - Nagaveni Vamsi; Sesha Sairam Ragulagadda; Ashudeb Dutta; Shiv Govind Singh (APCCAS, 2016)

Silk piezoelectric thin films: Materials to devices. - Jose Joseph; Sai Saraswathi; Anshika Agarwal; Shiv Govind Singh; Siva Rama Krishna Vanjari (IEEE SENSORS, 2016)

Zinc oxide nanowire modified flexible plastic platform for immunosensing. - Brince Paul; R. Ranga Reddy; Siva Rama Krishna Vanjari; Shiv Govind Singh (IEEE SENSORS, 2016)

A low-cost multi-phase 3A buck converter with improved ripple cancellation for wide supply range. - K. T. Hafeez; Ashudeb Dutta; Shiv Govind Singh; Krishna Kanth Gowri Avalur (ISCAS, 2016)

A 1V, -26dBm sensitive auto configurable mixed converter mode RF energy harvesting with wide input range. - Nagaveni Vamsi; V. Priya; Ashudeb Dutta; Shiv Govind Singh (ISCAS, 2016)

Transient suppression with pseudo error voltage technique for wide supply range automotive DC-DC converters. - K. T. Hafeez; Ashudeb Dutta; Shiv Govind Singh; Krishna Kanth Gowri Avalur (MWSCAS, 2016)

Ultrasensitive, Label Free, Chemiresistive Nanobiosensor Using Multiwalled Carbon Nanotubes Embedded Electrospun SU-8 Nanofibers. - Matta Durga Prakash; Siva Rama Krishna Vanjari; Chandra Shekhar Sharma; Shiv Govind Singh (Sensors, 2016)

Area-elficient interlayer signal propagation in 3D IC by introducing electron spin. - Sanghamitra Debroy; Amit Acharyya; Shiv Govind Singh; Swati Ghosh Acharyya (ECCTD, 2017)

Electrospun polyaniline nanofiber based chemiresistive nanobiosensor platform for DNA Hybridization detection. - Suryasnata Tripathy; Arun Naithani; Siva Rama Krishna Vanjari; Shiv Govind Singh (IEEE SENSORS, 2017)

Source localization via aermod-based simulation under mean squared error criterion: Demonstration using field data. - Anand Kakarla; Asif Qureshi; Thatikonda Shashidhar; Swades De; Shiv Govind Singh; Soumya Jana (IGARSS, 2017)

Optimal Don't Care Filling for Minimizing Peak Toggles During At-Speed Stuck-At Testing. - Satya Trinadh Adireddy; Seetal Potluri; Ch. Sobhan Babu; Veezhinathan Kamakoti; Shiv Govind Singh (ACM Trans. Design Autom. Electr. Syst., 2017)

Selective Anisotropic Dry Etching of Piezoelectric Silk Microstructures Using Oxygen Plasma Ashing. - D. V. Santhosh Kumar Gunapu; Jose Joseph; Shiv Govind Singh; Siva Rama Krishna Vanjari (IEEE SENSORS, 2018)

Exploring the Piezoelectric Property of Electrospun Silk Nanofibers for Sensing Applications. - Jose Joseph; Manish Kumar; Survasnata Trinathy; G. D. V. Santhosh Kumar; Shiv Govind Singh; Siva Rama Krishna Vanjari (IEEE SENSORS, 2018)

A Highly Flexible Tactile Sensor with Self-Poled Electrospun PVDF Nanofiber. - Jose Joseph; Manish Kumar; Suryasnata Tripathy; G. D. V. Santhosh Kumar; Shiv Govind Singh; Siva Rama Krishna Vanjari (IEEE SENSORS, 2018)

Modeling and Fabrication Aspects of PVDF as a Membrane Material for Air Borne PMUT Applications. - Lisa Sarkar; Jose Joseph; Shiv Govind Singh; Siva Rama Krishna Vanjari (IEEE SENSORS, 2018)

A Novel Down Conversion Mixer with Low/High Band Re-configurable Transconductance Amplifier in 65nm CMOS Process. - Nisha Gupta; Ashudeb Dutta; Shiv Govind Singh (LASCAS, 2021)

Silk Piezoelectric Tactile Sensors: The Way Forward to Developing Intelligent Implantable Sensors. - Satish Bonam; Jose Joseph; Aditya Bhagavathi; Shiv Govind Singh; Siva Rama Krishna Vanjari (ISCAS, 2022)

An Android Based Portable Biosensor System for Cardiac Risk-Stratification by Detecting HFABP in Human Plasma. - Partha Pratim Goswami; Swati Mohanty; Ullas Pandey; Shiv Govind Singh (SENSORS, 2023)

Aptamer Assisted Simultaneous Detection of Lead and Arsenic in Water Using a Handheld System. - Swati Mohanty; Partha Pratim Goswami; Gajendranath Chowdary; Shiv Govind Singh (IEEE SENSORS, 2024)

Benchmarking of Multi-Bridge-Channel FETs Toward Analog and Mixed-Mode Circuit Applications. - V. Bharath Sreenivasulu; Aruna Kumari Neelam; Asisa Kumar Panigrahy; Lokesh Vakkalakula; Jawar Singh; Shiv Govind Singh (IEEE Access, 2024)