Influence of wafer thinning process on backside damage in 3D integration. - Tadao Nakamura; Yoriko Mizushima; Hideki Kitada; Young-Suk Kim; Nobuhide Maeda; Shoichi Kodama; Ryuichi Sugie; Hiroshi Hashimoto; Akihito Kawai; Kazuhisa Arai; Akira Uedono; Takayuki Ohba (3DIC, 2013)

Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. - Yoriko Mizushima; Young-Suk Kim; Tomoji Nakamura; Shoichi Kodama; Nobuhide Maeda; Koji Fujimoto; Takayuki Ohba (3DIC, 2014)

Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. - Takayuki Ohba; Young-Suk Kim; Yoriko Mizushima; Nobuhide Maeda; Koji Fujimoto; Shoichi Kodama (IEICE Electron. Express, 2015)