All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers. - Fumihiro Inoue; Takumi Yokoyama; Hiroshi Miyake; Shukichi Tanaka; Toshifumi Terui; Tomohiro Shimizu; Shoso Shingubara (3DIC, 2010)

Low temperature through-Si via fabrication using electroless deposition. - Fumihiro Inoue; Harold Philipsen; Alex Radisic; Silvia Armini; Peter Leunissen; Hiroshi Miyake; Ryohei Arima; Tomohiro Shimizu; Toshiaki Ito; Hirofumi Seki; Yuko Shinozaki; Tomohiko Yamamoto; et al. (3DIC, 2011)

Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV. - S. Nishizawa; Ryohei Arima; Tomohiro Shimizu; Shoso Shingubara; Fumihiro Inoue (3DIC, 2013)

All-wet TSV filling with highly adhesive displacement plated Cu seed layer. - Kohei Ohta; Atsushi Hirate; Yuto Miyachi; Tomohiro Shimizu; Shoso Shingubara (3DIC, 2015)

Study of MacEtch using Additives for Preparation of TSV. - Shunsuke Hanatani; Takuya Yorioka; Tomohiro Shimizu; Takeshi Ito; Shoso Shingubara (3DIC, 2019)

TSV Formation Using a Direct CU Electroplating on Electroless Plated Barrier Layer with a Low Resistivity. - Yuko Ishii; Takanobu Hamamura; Tomohiro Shimizu; Takeshi Ito; Shoso Shingubara (3DIC, 2024)

Electrochemical Biosensor Using Methylene Blue as an Electrochemical Mediator Coupling with DNA Aptamer. - Koki Yamashita; Tomohiro Shimizu; Shoso Shingubara; Hitoshi Ishida; Akinori Kuzuya; Takeshi Ito (IEEE SENSORS, 2024)