Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. - Kenji Okabe; Horagodage Prabhath Jeewan; Shota Yamagiwa; Takeshi Kawano; Makoto Ishida; Ippei Akita (Sensors, 2015)