Stacked solder bumping technology for improved solder joint reliability. - Xingsheng Liu; Shuangyan Xu; Guo-Quan Lu; David A. Dillard (Microelectron. Reliab., 2001)

Effect of substrate flexibility on solder joint reliability. - Xingsheng Liu; Shuangyan Xu; Guo-Quan Lu; David A. Dillard (Microelectron. Reliab., 2002)

Critical Nodes Identification in Large Networks: An Inclination-Based Model. - Chen Chen 017; Xijuan Liu; Shuangyan Xu; Mengqi Zhang; Xiaoyang Wang 002; Xuemin Lin 001 (WISE (1), 2021)

Critical Nodes Identification in Large Networks: The Inclined and Detached Models. - Renjie Sun; Chen Chen 017; Xijuan Liu; Shuangyan Xu; Xiaoyang Wang 002; Xuemin Lin 001 (World Wide Web, 2022)