Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. - Hisashi Kino; Hideto Hashiguchi; Seiya Tanikawa; Yohei Sugawara; Shunsuke Ikegaya; Takafumi Fukushima; Mitsumasa Koyanagi; Tetsu Tanaka (3DIC, 2015)