Phase control for resonant DC-DC converter with class-DE inverter and class-E rectifier. - Hiroo Sekiya; Shunsuke Nemoto; Jianming Lu; Takashi Yahagi (IEEE Trans. Circuits Syst. I Regul. Pap., 2006)

New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking. - Masahiro Aoyagi; Naoya Watanabe; Motohiro Suzuki; Katsuya Kikuchi; Shunsuke Nemoto; Noriaki Arima; Misaki Ishizuka; Koji Suzuki; Toshio Shiomi (3DIC, 2013)

Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging. - Katsuya Kikuchi; Fumiki Kato; Shunsuke Nemoto; Hiroshi Nakagawa; Masahiro Aoyagi; Youtaro Yasu; Kohji Koshiji (3DIC, 2013)

Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. - Samson Melamed; Naoya Watanabe; Shunsuke Nemoto; Haruo Shimamoto; Katsuya Kikuchi; Masahiro Aoyagi (Microelectron. Reliab., 2016)

Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits. - Samson Melamed; Naoya Watanabe; Shunsuke Nemoto; Haruo Shimamoto; Katsuya Kikuchi; Masahiro Aoyagi (Microelectron. Reliab., 2017)