Thermal Resistance Network Derivative (TREND) Model for Efficient Thermal Simulation and Design of ICs and Packages. - Shunxiang Lan; Min Tang; Liang Chen 025; Junfa Mao (DAC, 2024)

Flexible Thermal Conductance Model (TCM) for Efficient Thermal Simulation of 3-D ICs and Packages. - Shunxiang Lan; Min Tang; Jun Ma (DATE, 2025)

Equivalent Thermal Conductance Network (ETCN) Model for Domain Decomposition and Efficient Thermal Simulation of GaN HEMTs. - Shunxiang Lan; Min Tang (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2025)