Protrusion of electroplated copper filled in through silicon vias during annealing process. - Si Chen 007; Fei Qin; Tong An; Pei Chen; Bin Xie; Xunqing Shi (Microelectron. Reliab., 2016)

The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. - Si Chen 007; Zhizhe Wang; Yunfei En; Yun Huang 006; Fei Qin; Tong An (Microelectron. Reliab., 2018)

Simulation Analysis of Mechanical Response of Wire Bonding in SiP under Thermal-mechanical-electrical Coupling Load. - Fangzhou Chen; Si Chen 007; Bin Zhou; Yun Huang 006; Fei Qin (ICTA, 2020)

Life assessment method of electronic components based on reliability factor sharing model. - Linlin Shi; Peiliang Yang; Bin Zhou; Si Chen 007; Zhenwei Zhou; Danni Hong (ACAI, 2022)