Top-down drift-diffusion versus bottom-up quasi-ballistic formalism in device compact modeling. - Xing Zhou; Junbin Zhang; Binit Syamal; Zhaomin Zhu; Hongtao Zhou; Siau Ben Chiah (MIXDES, 2013)

Compact Fermi potential model for heterostructure HEMTs with rectangular quantum well. - Arjun Ajaykumar; Xing Zhou; Binit Syamal; Siau Ben Chiah (ESSDERC, 2014)

Effect of metal work function on the DC characteristics of an asymmetric MOSFET with Schottky-based source. - Arjun Ajaykumar; Xing Zhou; Siau Ben Chiah (ISIC, 2016)

An on-chip integrated III-V / CMOS 125MSps 6-bit SAR ADC. - Sunny Sharma; Siau Ben Chiah; Xing Zhou; Chirn Chye Boon (ISIC, 2016)

Automatic place-and-route of emerging LED-driven wires within a monolithically-integrated CMOS-III-V process. - Tushar Krishna; Arya Balachandran; Siau Ben Chiah; Li Zhang; Bing Wang; Cong Wang; Kenneth Eng-Kian Lee; Jürgen Michel; Li-Shiuan Peh (DATE, 2017)

Monolithic Co-integration of III-V Materials into Foundry Si-CMOS in a Single Chip for Novel Integrated Circuits. - Xing Zhou; Siau Ben Chiah; Binit Syamal; Kenneth Eng-Kian Lee (ASICON, 2019)

Enabling Monolithic Heterogeneously Integrated Si/III-V Technology Platform. - Siau Ben Chiah; Xing Zhou; Kenneth Eng-Kian Lee (ASICON, 2021)

Scalable Compact Model for High-frequency GaN-HEMTs. - Xing Zhou; Siau Ben Chiah (ASICON, 2023)

Composite Sub-surface Model for RF GaN-HEMTs. - X. Zhou; W. Yang; Siau Ben Chiah (ISQED, 2024)