Multi-layer floorplanning for reliable system-on-package. - Pun Hang Shiu; Ramprasad Ravichandran; Siddharth Easwar; Sung Kyu Lim (ISCAS (5), 2004)

Wire congestion and thermal aware 3D global placement. - Karthik Balakrishnan; Vidit Nanda; Siddharth Easwar; Sung Kyu Lim (ASP-DAC, 2005)