Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding. - Simon J. Bleiker; Maaike M. Visser Taklo; Nicolas Lietaer; Andreas Vogl; Thor Bakke; Frank Niklaus (Micromachines, 2016)

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires. - Miku J. Laakso; Simon J. Bleiker; Jessica Liljeholm; Gustaf E. Martensson; Mikhail Asiatici; Andreas C. Fischer; Göran Stemme; Thorbjorn Ebefors; Frank Niklaus (IEEE Access, 2018)

Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays. - Tian Qin; Simon J. Bleiker; Sunil Rana; Frank Niklaus; Dinesh Pamunuwa (IEEE Access, 2018)

Measurement and Analysis of Dynamic Energy Consumption in Microelectromechanical Relays. - Qi Tang; Elliott Worsey; Mukesh Kumar Kulsreshath; Yue Fan; Yingying Li; Simon J. Bleiker; Harold Chong; Frank Niklaus; Dinesh Pamunuwa (ISCAS, 2025)