Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor. - Simon Schlipf; André Clausner; Jens Paul; Simone Capecchi; Laura Wambera; Karsten Meier; Ehrenfried Zschech (IRPS, 2020)

Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. - Viktor Dudash; Kashi Vishwanath Machani; Bjoern Boehme; Simone Capecchi; Jungtae Ok; Karsten Meier; Frank Kuechenmeister; Marcel Wieland; Karlheinz Bock (IRPS, 2023)