Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices. - Songbai Xue; Yuxiu Wu; Zongjie Han; Ling Zhang (CGVR, 2006)

Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages. - Liang Zhang; Songbai Xue; Li-li Gao; Zhong Sheng; Sheng-lin Yu; Yan Chen; Wei Dai; Feng Ji; Zeng Guang (Microelectron. Reliab., 2010)

Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments. - Jie Wu; Songbai Xue; Jingwen Wang; Jianxin Wang (Microelectron. Reliab., 2017)