Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI). - Guruprasad Katti; S. W. Ho; Li Hong Yu; Songbai Zhang; Rahul Dutta; Roshan Weerasekera; Ka-Fai Chang; Jong-Kai Lin; Srinivasa Rao Vempati; Surya Bhattacharya (IEEE Des. Test, 2015)

Image Reconstruction Based on Total Variation Minimization for Radioactive Wastes Tomographic Gamma Scanning From Sparse Projections. - Rui Shi; Honglong Zheng; Xianguo Tuo; Changming Wang; Jianbo Yang; Yi Cheng; Mingzhe Liu; Songbai Zhang (IEEE Access, 2021)