Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. - Se Young Yang; Young-Doo Jeon; Soon-Bok Lee; Kyung-Wook Paik (Microelectron. Reliab., 2006)

An Approach to Analyzing Commonality and Variability of Features using Ontology in a Software Product Line Engineering. - Soon-Bok Lee; Jin-Woo Kim; Chee-Yang Song; Doo-Kwon Baik (SERA, 2007)

A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages. - Kyung-Woon Jang; Jin-Hyoung Park; Soon-Bok Lee; Kyung-Wook Paik (Microelectron. Reliab., 2012)

Chip warpage model for reliability prediction of delamination failures. - Se Young Yang; Woon-Seong Kwon; Soon-Bok Lee (Microelectron. Reliab., 2012)