Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. - Xuefen Ong; Soon Wee Ho; Yue Ying Ong; Leong Ching Wai; Kripesh Vaidyanathan; Yeow Kheng Lim; David Yeo; Kai Chong Chan; Juan Boon Tan; Dong Kyun Sohn; Liang Choo Hsia; Zhong Chen 004 (Microelectron. Reliab., 2009)

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. - Yue Ying Ong; Soon Wee Ho; Kripesh Vaidyanathan; Vasarla Nagendra Sekhar; Ming Chinq Jong; Samuel Lim Yak Long; Vincent Lee Wen Sheng; Leong Ching Wai; Vempati Srinivasa Rao; Jimmy Ong; Xuefen Ong; Xiaowu Zhang; et al. (Microelectron. Reliab., 2010)

Machine-learning based methodologies for 3d x-ray measurement, characterization and optimization for buried structures in advanced ic packages. - Ramanpreet Singh Pahwa; Soon Wee Ho; Ren Qin; Richard Chang 002; Oo Zaw Min; Jie Wang 042; Vempati Srinivasa Rao; Tin Lay Nwe; Yanjing Yang; Jens Timo Neumann; Ramani Pichumani; Thomas Gregorich (CoRR, 2021)