Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. - Soon-Wook Kim; Lan Peng; Andy Miller; Gerald Beyer; Eric Beyne; Chung-Sun Lee (3DIC, 2015)

Process Complexity and Cost Considerations of Multi-Layer Die Stacks. - Dimitrios Velenis; Joeri De Vos; Soon-Wook Kim; Jaber Derakhshandeh; Pieter Bex; Giovanni Capuz; Samuel Suhard; Kenneth June Rebibis; Stefaan Van Huylenbroeck; Erik Jan Marinissen; Alain Phommahaxay; Andy Miller; et al. (3DIC, 2019)