Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC. - Donghyun Han; Youngkwang Lee; Sooryeong Lee; Sungho Kang 001 (ISOCC, 2021)

A Circular-based TSV Repair Architecture. - Youngkwang Lee; Donghyun Han; Sooryeong Lee; Sungho Kang 001 (ISOCC, 2021)

PROG: Per-Row Output Generator for BOST. - Sooryeong Lee; Hayoung Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang 001 (ISOCC, 2022)

FAME: Fault Address Memory Structure for Repair Time Reduction. - Hayoung Lee; Sooryeong Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang 001 (ISOCC, 2022)

An Improved Early Termination Methodology Using Convolutional Neural Network. - Seung Ho Shin; Hayoung Lee; Sooryeong Lee; Younwoo Yoo; Sungho Kang 001 (ISOCC, 2022)

Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture. - Youngkwang Lee; Donghyun Han; Sooryeong Lee; Sungho Kang 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023)

Scan Architecture with Data Observation for Multiple Scan Cell Fault Diagnosis. - Juyong Lee; Sooryeong Lee; Hayoung Lee; Sungho Kang 001 (ISOCC, 2024)

APAPG: Address Pre-Processed ALPG for High-Speed Linear Test. - Sooryeong Lee; Hayoung Lee; Juyong Lee; Sungho Kang 001 (ISOCC, 2024)

A New Fail Address Memory Architecture for Cost-Effective ATE. - Hayoung Lee; Sooryeong Lee; Sungho Kang 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2024)

RA-Aware Fail Data Collection Architecture for Cost Reduction. - Hayoung Lee; Sooryeong Lee; Sungho Kang 001 (IEEE Trans. Very Large Scale Integr. Syst., 2024)

A New ISA for High-Speed and Area-Efficient ALPG. - Juyong Lee; Hayoung Lee; Sooryeong Lee; Sungho Kang 001 (IEEE Trans. Circuits Syst. II Express Briefs, 2024)

A New Pipelined Output Data Reducer of BOST for Improved Parallelism. - Sooryeong Lee; Hayoung Lee; Juyong Lee; Sungho Kang 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2025)

A Cost-Effective Per-Pin ALPG for High-Speed Memory Testing. - Juyong Lee; Hayoung Lee; Sooryeong Lee; Sungho Kang 001 (IEEE Trans. Very Large Scale Integr. Syst., 2025)