Small-World Network Enabled Energy Efficient and Robust 3D NoC Architectures. - Sourav Das 002; Dongjin Lee; Dae Hyun Kim 004; Partha Pratim Pande (ACM Great Lakes Symposium on VLSI, 2015)

Optimizing 3D NoC Design for Energy Efficiency: A Machine Learning Approach. - Sourav Das 002; Janardhan Rao Doppa; Daehyun Kim 004; Partha Pratim Pande; Krishnendu Chakrabarty (ICCAD, 2015)

Reliability and performance trade-offs for 3D NoC-enabled multicore chips. - Sourav Das 002; Janardhan Rao Doppa; Partha Pratim Pande; Krishnendu Chakrabarty (DATE, 2016)

Energy-efficient and reliable 3D network-on-chip (NoC): architectures and optimization algorithms. - Sourav Das 002; Janardhan Rao Doppa; Partha Pratim Pande; Krishnendu Chakrabarty (ICCAD, 2016)

Design-Space Exploration and Optimization of an Energy-Efficient and Reliable 3D Small-world Network-on-Chip. - Sourav Das 002; Janardhan Rao Doppa; Partha Pratim Pande; Krishnendu Chakrabarty (CoRR, 2016)

Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise. - Sourav Das 002; Janardhan Rao Doppa; Partha Pratim Pande; Krishnendu Chakrabarty (DATE, 2017)

Energy-efficient and robust 3D NoCs with contactless vertical links (Invited paper). - Sourav Das 002; Srinivasan Gopal; Deukhyoun Heo; Partha Pratim Pande (ICCAD, 2017)

Monolithic 3D-Enabled High Performance and Energy Efficient Network-on-Chip. - Sourav Das 002; Janardhan Rao Doppa; Partha Pratim Pande; Krishnendu Chakrabarty (ICCD, 2017)

Performance-thermal trade-offs for a VFI-enabled 3D NoC architecture. - Dongjin Lee; Sourav Das 002; Partha Pratim Pande (ISQED, 2017)

Energy and Area Efficient Near Field Inductive Coupling: A Case Study on 3D NoC. - Srinivasan Gopal; Sourav Das 002; Deukhyoun Heo; Partha Pratim Pande (NOCS, 2017)

Design-Space Exploration and Optimization of an Energy-Efficient and Reliable 3-D Small-World Network-on-Chip. - Sourav Das 002; Janardhan Rao Doppa; Partha Pratim Pande; Krishnendu Chakrabarty (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017)

VFI-Based Power Management to Enhance the Lifetime of High-Performance 3D NoCs. - Sourav Das 002; Dongjin Lee; Wonje Choi 001; Janardhan Rao Doppa; Partha Pratim Pande; Krishnendu Chakrabarty (ACM Trans. Design Autom. Electr. Syst., 2017)

A PVT-Resilient No-Touch DFT Methodology for Prebond TSV Testing. - Sourav Das 002; Fei Su; Sreejit Chakravarty (ITC, 2018)

Abetting Planned Obsolescence by Aging 3D Networks-on-Chip. - Sourav Das 002; Kanad Basu; Janardhan Rao Doppa; Partha Pratim Pande; Ramesh Karri; Krishnendu Chakrabarty (NOCS, 2018)

Design Space Exploration of 3D Network-on-Chip: A Sensitivity-based Optimization Approach. - Dongjin Lee; Sourav Das 002; Dae Hyun Kim 004; Janardhan Rao Doppa; Partha Pratim Pande (ACM J. Emerg. Technol. Comput. Syst., 2018)

Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-Chip. - Dongjin Lee; Sourav Das 002; Janardhan Rao Doppa; Partha Pratim Pande; Krishnendu Chakrabarty (ACM Trans. Design Autom. Electr. Syst., 2018)

High-Performance and Small-Form Factor Near-Field Inductive Coupling for 3-D NoC. - Srinivasan Gopal; Sourav Das 002; Pawan Agarwal; Sheikh Nijam Ali; Deukhyoun Heo; Partha Pratim Pande (IEEE Trans. Very Large Scale Integr. Syst., 2018)

A Comparative Study of Pre-bond TSV Test Methodologies. - Sourav Das 002; Fei Su; Sreejit Chakravarty (VTS, 2019)

Analyzing power-thermal-performance trade-offs in a high-performance 3D NoC architecture. - Dongjin Lee; Sourav Das 002; Partha Pratim Pande (Integr., 2019)

Impact of Electrostatic Coupling on Monolithic 3D-enabled Network on Chip. - Dongjin Lee; Sourav Das 002; Janardhan Rao Doppa; Partha Pratim Pande; Krishnendu Chakrabarty (ACM Trans. Design Autom. Electr. Syst., 2019)

Testing of Prebond Through Silicon Vias. - Sourav Das 002; Fei Su; Sreejit Chakravarty (IEEE Des. Test, 2020)

A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC. - Srinivasan Gopal; Sourav Das 002; Partha Pratim Pande; Deukhyoun Heo (IEEE Trans. Circuits Syst., 2020)