Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. - John U. Knickerbocker; Paul S. Andry; L. Paivikki Buchwalter; Alina Deutsch; Raymond R. Horton; Keith A. Jenkins; Young Hoon Kwark; Gerald McVicker; Chirag S. Patel; Robert J. Polastre; Christian D. Schuster; Arun Sharma; et al. (IBM J. Res. Dev., 2005)

Multirate controller for Dual actuated servomechanism in Hard Disk Drive. - Abdullah Al Mamun 002; T. Suthasun; Sri M. Sri-Jayantha; Tong Heng Lee (Control. Intell. Syst., 2007)

Three-dimensional silicon integration. - John U. Knickerbocker; Paul S. Andry; Bing Dang; Raymond R. Horton; Mario J. Interrante; Chirag S. Patel; Robert J. Polastre; Katsuyuki Sakuma; Ranjani Sirdeshmukh; Edmund J. Sprogis; Sri M. Sri-Jayantha; Antonio M. Stephens; et al. (IBM J. Res. Dev., 2008)

Thermomechanical modeling of 3D electronic packages. - Sri M. Sri-Jayantha; Gerald McVicker; Kerry Bernstein; John U. Knickerbocker (IBM J. Res. Dev., 2008)

Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy. - Lorenzo Valdevit; V. Khanna; Arun Sharma; Sri M. Sri-Jayantha; David L. Questad; K. Sikka (Microelectron. Reliab., 2008)