Inducing Chaos in MOSFET-Based Electronic Circuits. - Srinivasan Gopal; Ying-Cheng Lai (Circuits Syst. Signal Process., 2009)

Energy-efficient and robust 3D NoCs with contactless vertical links (Invited paper). - Sourav Das 002; Srinivasan Gopal; Deukhyoun Heo; Partha Pratim Pande (ICCAD, 2017)

Energy and Area Efficient Near Field Inductive Coupling: A Case Study on 3D NoC. - Srinivasan Gopal; Sourav Das 002; Deukhyoun Heo; Partha Pratim Pande (NOCS, 2017)

A 28GHz 41%-PAE linear CMOS power amplifier using a transformer-based AM-PM distortion-correction technique for 5G phased arrays. - Sheikh Nijam Ali; Pawan Agarwal; Joe Baylon; Srinivasan Gopal; Luke Renaud; Deukhyoun Heo (ISSCC, 2018)

A Spatial Multi-Bit Sub-1-V Time-Domain Matrix Multiplier Interface for Approximate Computing in 65-nm CMOS. - Srinivasan Gopal; Pawan Agarwal; Joe Baylon; Luke Renaud; Sheikh Nijam Ali; Partha Pratim Pande; Deukhyoun Heo (IEEE J. Emerg. Sel. Topics Circuits Syst., 2018)

A 16-Gb/s Low-Power Inductorless Wideband Gain-Boosted Baseband Amplifier With Skewed Differential Topology for Wireless Network-on-Chip. - Joe Baylon; Xinmin Yu; Srinivasan Gopal; Reza Molavi; Shahriar Mirabbasi; Partha Pratim Pande; Deukhyoun Heo (IEEE Trans. Very Large Scale Integr. Syst., 2018)

High-Performance and Small-Form Factor Near-Field Inductive Coupling for 3-D NoC. - Srinivasan Gopal; Sourav Das 002; Pawan Agarwal; Sheikh Nijam Ali; Deukhyoun Heo; Partha Pratim Pande (IEEE Trans. Very Large Scale Integr. Syst., 2018)

Hierarchical Design Methodology and Optimization for Proximity Communication based Contactless 3D ThruChip Interface. - Srinivasan Gopal; Deukhyoun Heo; Tanay Karnik (3DIC, 2019)

A 25-35 GHz Neutralized Continuous Class-F CMOS Power Amplifier for 5G Mobile Communications Achieving 26% Modulation PAE at 1.5 Gb/s and 46.4% Peak PAE. - Sheikh Nijam Ali; Pawan Agarwal; Srinivasan Gopal; Shahriar Mirabbasi; Deukhyoun Heo (IEEE Trans. Circuits Syst. I Regul. Pap., 2019)

Analysis of Systematic Losses in Hybrid Envelope Tracking Modulators. - Luke Renaud; Joe Baylon; Srinivasan Gopal; Md. Aminul Hoque; Deukhyoun Heo (IEEE Trans. Circuits Syst. I Regul. Pap., 2019)

Making a Case for Partially Connected 3D NoC: NFIC versus TSV. - Aqeeb Iqbal Arka; Srinivasan Gopal; Janardhan Rao Doppa; Deukhyoun Heo; Partha Pratim Pande (ACM J. Emerg. Technol. Comput. Syst., 2020)

A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC. - Srinivasan Gopal; Sourav Das 002; Partha Pratim Pande; Deukhyoun Heo (IEEE Trans. Circuits Syst., 2020)

Trends and Opportunities for SRAM Based In-Memory and Near-Memory Computation. - Srivatsa Srinivasa; Akshay Krishna Ramanathan; Jainaveen Sundaram; Dileep Kurian; Srinivasan Gopal; Nilesh Jain; Anuradha Srinivasan; Ravi R. Iyer 001; Vijaykrishnan Narayanan; Tanay Karnik (ISQED, 2021)

A Reconfigurable Asynchronous SERDES for Heterogenous Chiplet Interconnects. - Jainaveen Sundaram; Srinivasan Gopal; Thomas P. Thomas; Edward Burton; Erika Ramirez (ISQED, 2021)

Diagnosis of Inter-Turn Shorts of Loaded Transformer Under Various Load Currents and Power Factors; Impulse Voltage-Based Frequency Response Approach. - Natarajan Shanmugam; Srinivasan Gopal; Balasubramanian Madanmohan; S. P. Balaji; Rajesh Rajamani (IEEE Access, 2021)