Thermal and mechanical effects of voids within flip chip soldering in LED packages. - Yang Liu 103; Stanley Y. Y. Leung; Jia Zhao; Cell K. Y. Wong; Cadmus A. Yuan; Guoqi Zhang; Fenglian Sun; Liangliang Luo (Microelectron. Reliab., 2014)

Development of ocular viscosity characterization method. - Shu-Hao Lu; Guo-Zhen Chen; Stanley Y. Y. Leung; David C. C. Lam (EMBC, 2016)