Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. - Julien Magnien; Lisa Mitterhuber; Jördis Rosc; Franz Schrank; Stefan Hörth; Lena Goullon; Matthias Hutter; Stefan Defregger; Elke Kraker (Microelectron. Reliab., 2017)

Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation. - Lisa Mitterhuber; Stefan Defregger; René Hammer; Julien Magnien; Franz Schrank; Stefan Hörth; Matthias Hutter; Elke Kraker (Microelectron. Reliab., 2017)

Parameter driven monitoring for a flip-chip LED module under power cycling condition. - Julien Magnien; Lisa Mitterhuber; Jördis Rosc; Franz Schrank; Stefan Hörth; Matthias Hutter; Stefan Defregger; Elke Kraker (Microelectron. Reliab., 2018)

Thermal transient measurement and modelling of a power cycled flip-chip LED module. - Lisa Mitterhuber; Stefan Defregger; Julien Magnien; Jördis Rosc; René Hammer; Lena Goullon; Matthias Hutter; Franz Schrank; Stefan Hörth; Elke Kraker (Microelectron. Reliab., 2018)

A Comprehensive Review on the Core Thermal Management Improvement Concepts in Power Electronics. - Sina Lohrasbi; René Hammer; Werner Essl; Georg Reiss; Stefan Defregger; Wolfgang Sanz (IEEE Access, 2020)