Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits. - Yann Civale; Herman Meynen; Ranjith S. E. John; Peng-Fei Fu; Craig R. Yeakle; Sheng Wang; Stefan Krausse; Thomas Rapps; Stefan Lutter (3DIC, 2013)