ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness. - Stefano de Filippis; Vladimír Kosel; Donald Dibra; Stefan Decker; Helmut Köck; Andrea Irace (Microelectron. Reliab., 2011)

Improved thermal management of low voltage power devices with optimized bond wire positions. - Helmut Köck; Christian Djelassi; Stefano de Filippis; Robert Illing; Michael Nelhiebel; Markus Ladurner; Michael Glavanovics; Dionyz Pogany (Microelectron. Reliab., 2011)

Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices. - Stefano de Filippis; Helmut Köck; Michael Nelhiebel; Vladimír Kosel; Stefan Decker; Michael Glavanovics; Andrea Irace (Microelectron. Reliab., 2012)

FEM simulation approach to investigate electro-thermal behavior of power transistors in 3-D. - Vladimír Kosel; Stefano de Filippis; Liu Chen; Stefan Decker; Andrea Irace (Microelectron. Reliab., 2013)