Time-independent elastic-plastic behaviour of solder materials. - Steffen Wiese; Sven Rzepka (Microelectron. Reliab., 2004)

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders. - Steffen Wiese; Klaus-Jürgen Wolter (Microelectron. Reliab., 2004)

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. - Mike Roellig; Rainer Dudek; Steffen Wiese; Bjoern Boehme; Bernhard Wunderle; Klaus-Jürgen Wolter; Bernd Michel (Microelectron. Reliab., 2007)

Creep of thermally aged SnAgCu-solder joints. - Steffen Wiese; Klaus-Jürgen Wolter (Microelectron. Reliab., 2007)

The effect of downscaling the dimensions of solder interconnects on their creep properties. - Steffen Wiese; Mike Roellig; Maik Mueller; Klaus-Jürgen Wolter (Microelectron. Reliab., 2008)

Mechanical problems of novel back contact solar modules. - Frank Kraemer; Steffen Wiese; Erik Peter; Jonas Seib (Microelectron. Reliab., 2013)

Assessment of long term reliability of photovoltaic glass-glass modules vs. glass-back sheet modules subjected to temperature cycles by FE-analysis. - Frank Kraemer; Steffen Wiese (Microelectron. Reliab., 2015)

Experimental determination of the Young's modulus of copper and solder materials for electronic packaging. - Frank Kraemer; Mike Roellig; René Metasch; Joseph Al Ahmar; Karsten Meier; Steffen Wiese (Microelectron. Reliab., 2018)